Smt Hybrid Packaging 2017 Remains Leading Platform of Electronic Manufacturing

With an exhibition area of 26,200 square meters, 420 exhibitors, 259 conference attendees and more than 15,000 visitors, SMT Hybrid Packaging 2017 ended with great satisfaction on the part of the organizers and participants.

After three intensive days, the organizer of SMT Hybrid Packaging – Mesago Messe Frankfurt GmbH – ( looks back on a successful exhibition with conference and declared: “The SMT Hybrid Packaging presented itself as a forward-looking fair with solution character.

SMT Hybryd Packaging 2017

It is the only event in Europe that takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies. Visitors were able to get an excellent overview of the complete value added chain and conference attendees enlarged their knowledge,” explains Anthula Parashoudi, Vice President of Mesago Messe Frankfurt GmbH.

Positive response from exhibitors

Several exhibitors summarized their participation directly after the exhibition. Among other things, the SMT Hybrid Packaging scored with its competent visitors, including decision makers from all over the world: “Yamaha is very pleased of its participation at SMT Hybrid Packaging 2017 as we gained new leads and had several indeep conversations with new potential,” says Oumayma Grad, Marketing Communications Manger of Yamaha Motor Europe N.V.

Information and knowledge transfer on a high level

About 15,000 visitors informed themselfes especially about latest trends and innovations and seized the chance to network within the industry. Moreover, the SMT Hybrid Packaging offered many practice-related and user-friendly possibilities of extended studies. Diverse forum presentations and tutorials as well as the conference running parallel to the exhibition were used to refresh know-how and get into conversation with experts.


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