Connettori filo-scheda Pico-Clasp da Molex
Molex annuncia il rilascio di una nuova serie di connettori filo-scheda Pico-Clasp con passo da 1,00 mm.
Tutti gli articoli di Riccardo Busetto
Molex Wire-to-Board Connectors
Molex announces the release of a new set of 1.00 mm pitch wire-to-board Pico-Clasp Connectors.
Saldatura a vuoto: ultime da Alpha
La pasta saldante ALPHA OM-355, progettato specificamente per le applicazioni di saldatura a vuoto, è stata recentemente presentato da Alpha Assembly Solutions, azienda specializzata nella produzione di materiali per la saldatura elettronica.
A New Alpha Product for Vacuum Soldering Applications
Alpha Assembly Solutions, company specialized in the production of electronic soldering and bonding materials, has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.
Europlacer: It’s D-Day in France!
Right now, on the Europlacer manufacturing floor in Rocheserviere in France, the production team is preparing to build the 500th iineo placement machine.
D-Day francese per Europlacer
La cinquecentesima iineo sta per essere prodotta negli stabilimenti francesi di Rocheserviere di Europlacer. A riprova del successo riscontrato negli ultimi anni.
Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting
Nordson DAGE, announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester.
On-Wafer Bondtesting automatizzato da Nordson DAGE
Nordson DAGE è stata recentemente insignita del Global Technology Award 2018 nella categoria di apparecchiature di test per la sua macchina 4800 INTEGRA Automatic Wafer Bondtester.
SMT Hybrid Packaging cambia nome e si apre agli EMS
A partire dall’edizione del 2019, la fiera precedentemente nota come SMT Hybrid Packaging e che si tiene annualmente a Norimberga verrà indicata come SMTconnect.
SMT Hybrid Packaging Show Rebranded as SMTconnect
Starting with the 2019 exhibition, the show formerly known as SMT Hybrid Packaging in Nuremberg will be known as SMTconnect. The exhibition and technology days, set to take place at the Messe in Nuremberg, Germany, will occur from May 7-9, 2019.
SI Analysis Techniques for Automotive Ethernet Applications by Cadence
A top-down analysis methodology is a good strategy to design interfaces efficiently automotive Ethernet interfaces. An example from Cadence expert.
ALL Circuits Exhibits at electronica 2018
France’s largest EMS company, ALL Circuits, will participate at electronica 2018, taking place in Munich, Germany, from November 13th to 16th. ALL Circuist will share its vision for a better EMS world, where you can have it all on stand number 240 in hall A1.
