A New AWS Fast Track Video is On
AWS Electronics Group, one of Europe’s leading specialist Electronics Manufacturing Services (EMS) providers, unveils its latest company video showcasing AWS Fast Track – a dedicated stand-alone manufacturing facility offering small batch assembly, rapid prototyping and New Product Introduction (NPI) services.
VJ Electronix Summit LXi Expands Board Rework Capability to 1.2 m
VJ Electronix, Inc., a company specialized in rework technologies and global provider of advanced X-ray inspection and component counting systems, has announced an increase in compatible board size for the Summit LXi Rework System.
PVA Receives Patent for Optical Bonding Software
PVA announces that it received a patent for its optical bonding software
BTU International and Its New Aqua Scrub Flux Management Technology
BTU International, Inc. presents the Aqua Scrub flux management technology
EMS Introduces New High Thermal Conductivity Die and Component Attach Adhesive
EMS presents its TM-6520 low temperature cure adhesive.
Rosenberger OSI Cooperates with MICROSENS
Rosenberger OSI, manufacturer of innovative fiber optic cabling infrastructures in Europe, announces a new far-reaching partnership with MICROSENS.
Molex Wire-to-Board Connectors
Molex announces the release of a new set of 1.00 mm pitch wire-to-board Pico-Clasp Connectors.
A New Alpha Product for Vacuum Soldering Applications
Alpha Assembly Solutions, company specialized in the production of electronic soldering and bonding materials, has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.
Europlacer: It’s D-Day in France!
Right now, on the Europlacer manufacturing floor in Rocheserviere in France, the production team is preparing to build the 500th iineo placement machine.
On-Wafer Bondtesting automatizzato da Nordson DAGE
Nordson DAGE è stata recentemente insignita del Global Technology Award 2018 nella categoria di apparecchiature di test per la sua macchina 4800 INTEGRA Automatic Wafer Bondtester.
SMT Hybrid Packaging Show Rebranded as SMTconnect
Starting with the 2019 exhibition, the show formerly known as SMT Hybrid Packaging in Nuremberg will be known as SMTconnect. The exhibition and technology days, set to take place at the Messe in Nuremberg, Germany, will occur from May 7-9, 2019.
SI Analysis Techniques for Automotive Ethernet Applications by Cadence
A top-down analysis methodology is a good strategy to design interfaces efficiently automotive Ethernet interfaces. An example from Cadence expert.
