ISCRA dielectrics, a distributor specialized in fluid dispensing equipment, presents STD DUO 600, the most adequate solution for the microdosing of two-component epoxy resin.
An important innovation allows Almit MR-NH solder paste to obtain optimal results even for applications with an area ratio lower than 0.66.
MicroCare Europe BVBA will exhibit its range of sustainable cleaning solutions at productronica in Munich, Germany from 12–15 November 2019.
PVA announced that it has been granted a new patent pertains to the method of cleaning adhesive residue off of a dispensing nozzle using an integrated blow off mechanism.
KYZEN presents the new AQUANOX A4727 Next Generation Aqueous Assembly Cleaner and KYZEN ANALYST at Bitec, Bangkok btw June 19 and 22, 2019.
Seika Machinery, Inc. presents the new SPS-5A Solder Paste Mixer from MALCOM.
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste.
EMS presents its TM-6520 low temperature cure adhesive.
Alpha Assembly Solutions, company specialized in the production of electronic soldering and bonding materials, has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.
Electrolube will have a strong presence at this year’s Electronica event (Hall A2 - Stand 437) and will be showing a range of thermal management products, including its innovative new phase change materials.
PVA, a global expert in dispensing, coating and custom automation, presents its Delta 8 selective coating/dispensing system with special options, 5-gallon pump and 55-gallon drum pumps
In occasion of SMTA Guadalajara Expo & Tech Forum, next November 14-15, 2018, Seika will discuss the latest equipment from McDry, Unitech, Sawa and MALCOM.