Cleaning of Wearable Electronics Boosts Reliability
Wearable devices to diagnose and monitor patient health are becoming increasingly prevalent. This growth has had a huge boost in the last year due to the Coronavirus pandemic. How to clean them?
DELO: Thermally Conductive Battery Adhesive for Hybrid Vehicles
DELO has introduced a structural adhesive for batteries used in hybrid vehicles, designed for high-volume series production
Wearable Technology and the Future of Electronic Developments
Electrolube tries to put its experience at the disposal of a field that will grow in an incredible way in the near future: wearable technologies
KYZEN: How to Survive the COVID-19
KYZEN announces two important resources to help the industry during the COVID-19
An Effective Solution for the Microdosing
ISCRA dielectrics, a distributor specialized in fluid dispensing equipment, presents STD DUO 600, the most adequate solution for the microdosing of two-component epoxy resin.
Almit MR-NH Solder Paste: Small Area Ratio, Big Performance
An important innovation allows Almit MR-NH solder paste to obtain optimal results even for applications with an area ratio lower than 0.66.
MicroCare Presents its Sustainable Cleaning Solutions at productronica
MicroCare Europe BVBA will exhibit its range of sustainable cleaning solutions at productronica in Munich, Germany from 12–15 November 2019.
PVA Receives Patent for New Blow-Off Mechanism
PVA announced that it has been granted a new patent pertains to the method of cleaning adhesive residue off of a dispensing nozzle using an integrated blow off mechanism.
Next-Generation Cleaning Technologies from KYZEN
KYZEN presents the new AQUANOX A4727 Next Generation Aqueous Assembly Cleaner and KYZEN ANALYST at Bitec, Bangkok btw June 19 and 22, 2019.
MALCOM SPS-5A Solder Paste Mixer
Seika Machinery, Inc. presents the new SPS-5A Solder Paste Mixer from MALCOM.
SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste.
EMS Introduces New High Thermal Conductivity Die and Component Attach Adhesive
EMS presents its TM-6520 low temperature cure adhesive.