Seika New Solder Paste Testing Solutions

Seika Machinery, Inc. will introduce at the 2020 IPC APEX EXPO (Feb. 4-6, 2020 – San Diego Convention Center, California) the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom.

The PCU-285 Spiral Viscometer is designed to measure solder paste viscosity. It offers new functions that make it possible to create, execute and store measurement programs with or without a PC. The system uses a touch panel display for improved functionality and visibility.
The viscometer features a compact and enhanced heating unit, making it easier to put inside or take out the sample, and simplifies cleaning. Additionally, the temperature control and viscosity measurement have been improved greatly in stability and speed.

The Dip Tester DS-10S for selective soldering equipment improves process management efficiency by measuring solder temperature, soldering time, board temperature increases and peak conditions, soldering head movement speeds and solder head diameter all at once.
Seika also will show equipment from Hioki, Unitech, Sawa, McDry, Kyowa, and more respected names in the industry.


Inserisci il tuo commento
Inserisci il tuo nome