MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

MIRTEC announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

MIRTEC is a strong presence at the show each year, and 2017 is no exception. MIRTEC is planning to display several systems, including the MV-6E OMNI, MV-7OMNI, MS-11, and the Intelli-Sys Inc. Intelli-Track.


MIRTEC’s MV-6E OMNI, is one of the most industry’s technologically advanced AOI system. This all new MV-6E OMNI 3D In-Line AOI system is configured with MIRTEC’s exclusive OMNI-VISION®3D Inspection Technology which combines the 15 Megapixel ISIS Vision System with MIRTEC’s Digital Multi-Frequency Eight Projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s 15 Megapixel ISIS Vision System is a proprietary camera system designed and manufactured by the company for use with MIRTEC’s complete product range of inspection equipment.  MIRTEC’s Digital Multi-Frequency Eight Projection Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors.  This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.  Fully configured the new MIRTEC MV-6e OMNI machines feature four (4) 10 Megapixel Side-View Cameras in addition to the 15 Megapixel Top-Down Camera.


MIRTEC’s MV-7 OMNI-QHD 3D AOI Machine features the next generation of MIRTEC’s OMNI-VISION® 3D Inspection Technology in a High-Performance AC Servo Drive Platform.  This technology combines MIRTEC’s proprietary 15MP CoaXPress Vision System with MIRTEC’s Quantum High Definition (2048x1536) Digital Multi-Frequency 3D Projection Technology to provide  image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. The MV-7 OMNI-QHD machine also features four (4) 10 Mega Pixel Side-View Cameras for inspection of Regions of Interest which are not accessible with the 15 MP Top-Down Camera.


The MS-11 3D In-Line SPI Machine is configured with MIRTEC’s 15MP ISIS Vision System, providing enhanced image quality, high accuracy and fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-11 uses the same robust platform as MIRTEC’s MV-7 OMNI Series.

MIRTEC’s total quality management system software, INTELLISYS® also will be on display at the SMT Nuremberg show. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.


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