CyberOptics: 3D MX3000 FVI System for Memory Modules

CyberOptics Corporation, a global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression (MRS)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.
With two high-resolution MRS sensors, the 3D MX3000 memory module inspection system enables highly accurate, dual-sided final vision inspection and doubles productivity.

MRS sensor technology at the base of MX3000

Proprietary MRS technology meticulously identifies and rejects multiple reflections caused by shiny and reflective surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.
“Our MRS sensor technology is widely used in SMT, semiconductor and other challenging applications for inspection and metrology,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We have now integrated the 3D technology into our memory module inspection systems to deliver an unparalleled combination of high resolution, high accuracy and high speed. Ultimately, we’re enabling yield and productivity improvements for our customers.”
The fully automation-ready system provides in-line defect review stations and auto sorts false calls into good trays after review. In-line multiple module grippers minimize handing tact time and autoconversion supports various memory module form factors.


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