Nordson YESTECH, supplier of automated optical and conformal coating inspection systems for the electronics industry launched their latest innovation, the FX-942 Dual-Sided Optical Inspection System.
The new FX-942 incorporates12MP / 5 axis inspection technology for top and bottom side applications, including solder ball inspection, solder fillet quality inspection, lead and pin inspection and foreign material inspection. The 100 mm clearance allows for final assembly inspections with for tall components. The system can also be configured with proprietary UV lighting for automated conformal coating inspections.
Advanced Fusion Lighting and newly available image processing technology integrate several techniques, including 3D inspection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an unmatched low false failure rate.
The system has a Picture in Picture (PinP) feature and is MES / Industry 4.0 compatible.Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Don Miller, Nordson YESTECH’s Vice President commented, “We are delighted with the way the FX-942 addresses bottom and dual sided inspection requirements. Our development team worked hard on this latest innovation and we are excited about how it complements Nordson’s new position in the selective solder market.”