The new KIC smart reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.
The new thermal profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection & faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.
Additionally, the KIC Vantage smart thermal process system will be demonstrated. The KIC Vantage is an ecosystem that automatically acquires and delivers insightful information in real-time to allow factories to produce consistent quality at lower costs. The software is retrofitable and can work in conjunction with KIC’s profilers and automatic systems.
KIC will introduce the new KIC SPS thermal profiler in China in Stand 1G12# at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center.
Freddie Chan, General Manager KIC Asia commented: "We are excited to launch two new smart oven products that will shape up to become the enablers for the new age of smart factory. Both KIC SPS and KIC Vantage will take reflow and wave solder automation to a whole new level. In a leap of technological progress, these two innovations elevate the ability to acquire profile data and optimize the soldering machines from the local machine to the factory level, which will enable users to mine the reflow data across the whole factory and make insightful decisions."