Seika Machinery introduced the Sawa SC-BM500E Automatic Ultrasonic Stencil and Screen Cleaner. The system is specifically designed for high-density SMT applications.
The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.It accommodates a wide range of stencils from 320 mm×320 mm to 1000×740 mm, and is ideal for customers using multiple types of stencils and screens.
Three models of Sawa SC-BM500E
The SC-BM500E is available in three models to accommodate specific customer needs and is capable of cleaning inks, adhesives and solder paste from fine pitch apertures.