CyberOptics Corporation will present its ReticleSense Auto Multi Sensors (AMSR) – a wireless measurement devices for semiconductor fabs and equipment OEMs – at SPIE Advanced Lithography at the San Jose Convention Center, February 27-28 at booth #314.
ReticleSense Auto Multi Sensors (AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The AMSR speeds equipment qualification, shorten equipment maintenance cycles and lower equipment maintenance expenses. Multiple measurements can be captured and monitored in all locations of the reticle environment, saving equipment engineers or process engineers’ time and expense.
CyberOptics will also demonstrate the ReticleSense Airborne Particle Sensor (APSRQ) that speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. Engineers can save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs. In addition to small particles, the large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.
About the WaferSense and ReticleSense Line
The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensors (APS2 and APS3) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150 mm, 200 mm and 300 mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.