Scienscope’s Three New Systems
Scienscope International, an American supplier of cabinet style micro-focus X-ray systems, displayed three new systems at the 2019 IPC APEX EXPO, recently held at the San Diego Convention Center.
Mirtec Europe Celebrates 11th Anniversary with Most Successful Year to Date
MIRTEC announced that 2019 marks Mirtec Europe’s 11th year in business. After more than a decade, the company starts the year the strongest in its history.
Metcal: a Robotic Soldering to Increase Productivity
Metcal recently announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.
Cogiscan and Essegi Storagesolutions Collaborate to the Connected Factory
Cogiscan Inc., a Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, and Storagesolutions, a division of ESSEGI SYSTEM SERVICE s.r.l. specialized storage solution provider, announce a new strategic partnership
A New AWS Fast Track Video is On
AWS Electronics Group, one of Europe’s leading specialist Electronics Manufacturing Services (EMS) providers, unveils its latest company video showcasing AWS Fast Track – a dedicated stand-alone manufacturing facility offering small batch assembly, rapid prototyping and New Product Introduction (NPI) services.
VJ Electronix Summit LXi Expands Board Rework Capability to 1.2 m
VJ Electronix, Inc., a company specialized in rework technologies and global provider of advanced X-ray inspection and component counting systems, has announced an increase in compatible board size for the Summit LXi Rework System.
PVA Receives Patent for Optical Bonding Software
PVA announces that it received a patent for its optical bonding software
BTU International and Its New Aqua Scrub Flux Management Technology
BTU International, Inc. presents the Aqua Scrub flux management technology
EMS Introduces New High Thermal Conductivity Die and Component Attach Adhesive
EMS presents its TM-6520 low temperature cure adhesive.
Rosenberger OSI Cooperates with MICROSENS
Rosenberger OSI, manufacturer of innovative fiber optic cabling infrastructures in Europe, announces a new far-reaching partnership with MICROSENS.
Molex Wire-to-Board Connectors
Molex announces the release of a new set of 1.00 mm pitch wire-to-board Pico-Clasp Connectors.
A New Alpha Product for Vacuum Soldering Applications
Alpha Assembly Solutions, company specialized in the production of electronic soldering and bonding materials, has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.
