A Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
A new dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing) has been recently presented by...
Nano Dimension Targets IoT Market
Technological Breakthrough: 3D Printing of Rigid PCB Series Combined with Flexible Conductive Connectors in a Single Print.
Nano Dimension Ltd., company specialized in the field...
