Assembly processes

Smart Reflow Profiler for a New Smart Factory

The new KIC smart reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a...

A Premium Vacuum Vapor Phase Soldering Systems

IBL Technologies, LLC announced recently plans to introduce the new VAC745 and VAC765. The new premium vapor phase soldering machines will be displayed for...

A Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

A new dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing) has been recently presented by...

KYZEN ANALYST: a Real-Time Concentration Monitoring & Reporting System

The new KYZEN ANALYST Real-Time Concentration Monitoring & Reporting System will be demonstrate by Kyzen Team at the 2017 IPC APEX EXPO (Booth #2401). The...

PYRAMAX ZeroTurn Dual Chamber System

BTU International, Inc., recently announced plans to make a major new product introduction at the 2017 IPC APEX EXPO, scheduled to take place February...

Selezione di elettronica

PCB Magazine

css.php