BTU and TrueFlat Technology for Substrate Flatness 

TrueFlat developed by BTU

TrueFlat technology is an optional configuration of the PYRAMAX convection reflow oven for substrate flatness developed by BTU International. The company will demonstrate it in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

TrueFlat Technology

Designed for substrate thicknesses of 0.15 to 0.30 mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to PYRAMAX’s closed-loop convection heating.

Chart of Uniform Flatmess

Uniform flatness through consistent suction force throughout the entire thermal process

The new PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON Windows-based software including factory host/MES interface for Industry 4.0 compliance.

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