MIRTEC Receives IPC-2591 (CFX) for its 3D SMT Inspection Systems

MIRTEC Smart Factory SMT Inspection Systems

MIRTEC, announces that it has officially received IPC-2591 (CFX) Certification for its Award-Winning MV-6 OMNI 3D AOI Series and MS-11e 3D SPI Series.

IPC-2591 CFX standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed circuit board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly and transactional processes.

 

Towards Industry 4.0

“Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process.  This basically requires connectivity and communication from Machine-to-Machine (M2M) within the manufacturing line.  Since its inception, MIRTEC has been an adamant supporter of IPC’s CFX initiatives.   As such, we are pleased to officially receive this certification for our MV-6 OMNI 3D AOI Series,” commented Chanwha Pak, Chief Executive Officer at MIRTEC.

“Test and Inspection is an integral part of a Digitally-Connected Smart Factory in that these systems are specifically designed to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing process.  The challenge is to collect data from each machine within the manufacturing line and make that data available to the rest of the equipment within the line.  CFX is an ideal solution that can effectively eliminate M2M connectivity issues that have plagued the industry thus far”, stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division.

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