CyberOptics Corporation will demonstrate in Stand 1F32 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center, the new high-speed SQ3000 3D CMM, an extension of the MRS-enabled SQ3000 platform deemed best-in-class, along with the new MRS-enabled SE3000 SPI system.
CyberOptics SQ3000 3D CMM
The new SQ3000 3D CMM (Coordinate Measurement) system, powered by Multi-Reflection Suppression (MRS) technology, utilizes CyberCMM™, a new comprehensive software suite for coordinate measurement. In a lab or production environment, the MRS-enabled SQ3000 CMM system is extremely fast and highly accurate, with repeatable and reproducible measurements for metrology applications in manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics.
SPI System with MRS Sensor Technology
CyberCMM, an extensive suite of CMM tools, provides 100 percent metrology-grade measurement on all critical points much faster than a traditional CMM – seconds, not hours – including coplanarity, distance, height and datum X, Y, to name a few. A fast and easy setup can be performed as compared to a slow, engineering resource-intensive setup that typically requires multiple adjustments with traditional CMMs.
The new SE3000 SPI system is the very first SPI system to incorporate the industry-leading MRS sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.