Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, presents its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
The new material is designed to adhere to engineered plastics used in lens holder assemblies. These materials are engineered to withstand circuit board reliability test criteria.
The UV cured adhesive will cure rapidly when exposed to intense UV light centered at 365 nm. After fixturing with UV, the adhesive can be cured in 15 minutes at 110 ºC. The 631-39 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.