A new dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing) has been recently presented by Engineered Material Systems. His name is DF-3560 and has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3560 is available in thickness formats from 5-100 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-3560 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 154 °C (by DMA Tan Delta) and a moderate modulus of 3.25 GPa at 25 °C. It is hydrophobic in nature, providing chemical and moisture resistance. DF-3560 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-3560 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for making microfluidic channels on MEMS devices and integrated circuits.